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トップページ > アーカイブス > No.5(2002)10.High-aspect-ratio lithography for micro module fabrication

No.5(2002)10.High-aspect-ratio lithography for micro module fabrication

印刷用ページを表示する 更新日:2016年12月19日更新

 

Elito KAZAWA, Takeshi UENO and Tsutomu SHINODA

The ability to machine small parts using pattern electroplating is of growing interest in the electronics field, such as semiconductor test probes, sensors and waveguides for optical networks. Many of these applications require high-aspect-ratio lithography using thick resist films. Therefore, we examined the SU-8 which is a negative, epoxy-type, near-UV photoresist. We found refractive index changes in SU-8 formation with penetration light observation. By performing penetration light observation, it became possible to rationalize process in a short time.

 

Keywords
SU-8, LIGA, HARMS, MEMS, PEB

 


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