No.11（2016）10.Development of a void measuring method from 3D images

Norihiro Ohira，Shinichi Tomiyama

  Voids in materials and industrial products are important from the perspective of quality management and performance management. In this paper, we developed a non-destructive image processing method that can measure voids using X-ray computed tomography equipment. A newly-developed 3D labeling technique with a memory saving and high speed processing performance was used. In the experiment, we took measurements of the voids in the solder on circuit boards, confirming that it is possible to calculate the voids using one-twentieth of the memory space compared with the conventional method.

Keywords
X-ray computed tomography, Void, Labeling, Image processing

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