No.7（2012）4.Proposal of a new thermal micro 3-axis acceleration sensor

Katsuhisa Toshima

  A new thermal 3-axis acceleration sensor manufactured by combined silicon micromachining technique and bonding technique is proposed. This sensor is useful for tilt sensing due to its 3-axis differential temperature sensors which have the same sensibility. To realize a simple, low cost sensor, one SOI (silicon on insulator) substrate having four micro bridges, two SOI substrates having one micro bridge, respectively, and one silicon substrate as a spacer are sandwiched together, using a silicon anisotropic etching technique. Each of the micro bridges is combined with the micro heater and the PN-junction temperature sensor. On the other hand, the macro model of the thermal acceleration sensor is fabricated using 6 sets of chip resistor and chip diode, and its tilt characteristics are demonstrated.

Keywords
Microheater, Acceleration sensor, Tilt sensor, Temperature sensor, MEMS

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