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トップページ > 研究報告 > No.4(2009)13.Failure diagnosis of electronic circuit boards and components using infrared microscope

No.4(2009)13.Failure diagnosis of electronic circuit boards and components using infrared microscope

印刷用ページを表示する 更新日:2016年12月19日更新

Katsuhisa Toshima, Takeshi Kobayashi, Yoshiaki Haramoto, Toshihiro Takamatsu,
Yoshinori Nishino, Kazumasa Mikami

  This paper presents a diagnosis of the failure and degradation for electronic components and circuit boards using an infrared microscope. For example, overload tests of electrolytic capacitors, operation tests of printed circuit board relays, and pulsed high voltage tests of carbon film resistors, are demonstrated by measuring the temperature changes corresponding to the degradation of the components. Furthermore the applicability of this to estimate the failure and degradation of components on an electronic circuit board was estimated. The experimental data obtained from this report are useful for technical consultation on the, recently increasing, failure of electronic equipment and components.

Keywords

Failure diagnosis, Infrared camera, Reliability

 


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